The following are some EMI guidelines I learned out of my experience. Put it together and think it should be helpful to others as well. Feel free to drop your comments.
Groups:
Tags:
Related Articles
Recent Posts
-
Ring Ocillator Based True Random Number Generator
rerbagci 01/14/2019 -
Use UART for FPGA and SOC Debug
Lyndsy 02/03/2019 -
Several Caveats About Power Switch
Precise-Design 02/20/2019 -
Pspice for Dynamic IR Drop Analysis
JHicks 01/31/2019 -
Digest of White Paper on AI Chip Technologies 2018
HarrisGao 01/18/2019
Recent Premiums
-
Embedded Firmware Design and ECE Course Help
Brad_Smyth 04/16/2016 -
PCB/EMI Expert with 8+ Years of Experience
Mortensen 04/07/2016
-
Independent Firmware and System Consultant
JLee 02/02/2016
-
High Speed Digital Design Two-Day Workshop Handout
vonk 04/01/2016 -
FPGA and Digtial IP Design Firm Highly Experienced on PCIE/USB/MIPI
GVI_Tech 04/01/2016
Mortensen, nice summary. Good to know the 20H rule and ESD protection inside a enclosure. I was wondering whether to pour copper along the edge of board. I I heard someone suggests to run a loop of ground along the edge of board. Is it a good idea?
Hollis, I don’t think it is necessary to have metal along the edge of board. If you do, you may want to make sure it doesn’t form a loop otherwise there could be EMI issue.