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Mortensen
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Separate Ground Connection and Layout Power Components
Mortensen 05/25/2016 4.5 4.5/5 (2 ) -
[Tool] PCB Via Capacitance and Inductance
Mortensen 08/01/2016 4.6 4.6/5 (5 ) -
New DRAM access technology doubled overclocking performance
Mortensen 01/27/2018 -
A DDR3 PCB Design Case Study
Mortensen 04/15/2016
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Some PCB EMI Guidelines Learned out of My Previous Projects
Mortensen 04/07/2016 5 5/5 (1 )
Mortensen posted in
ASIC and FPGA 11 months ago · , 0, 1
#IO curve tracing
When we suspect if a io pad is broken, io curve tracing can help. Apply dc voltage to pad and ground and check current. VI current should be as shown for a normal pad. The rapid increasing currents at both pos and neg voltages are due to io #esd…[Read more]
Mortensen posted in
PCB and Board Design 11 months ago · , 0, 0
#Crystal osc circuit chip internal drive strength adjust
A typical #xtal osc is shown. Two caps and xtal are external to chip. The op amp is inside chip. To board designers, that op amp driving strength is not fixed. They normally have higher driving strength at bootup to make sure xtal…[Read more]
Mortensen posted an update 2 years, 4 months ago · , 1, 2
Which of trace A and B has more critical EMI issue?
Maybe it is straightforward for a seasoned EMI engineer. This interesting article uses Nimbic nWave to simulate the EMI issue and shows B is more…[Read more]
Mortensen posted an update 2 years, 4 months ago · , 1, 2
Use EMI scanner to see EMI emission and show the effect of decoupling capacitor
EMI scanner is a powerful and easy-to-use tool to deal with EMI…[Read more]